◇With different fluidity and thixotropy、good heat-resistant and sealing performance、strong adhesion、fast curing at room temperature and easy to apply.
◇With superior resistance to ozone 、ultraviolet rays、weather and superior electrical properties, DO not burn easy.
◇With superior resistance to cold and heat, good flexibility and intensity at temperatures ranging from -40℃ to +200℃.
◇Waterproof, superior resistance to media、diluted acid and diluted alkali.
◇With strong adhesion to copper、aluminium、PC、PET、as well as other electronic components.
◇Through curing, the colloid forms a middle-module perpetual elastomer with outstanding air tightness、 shock and vibration resistance.
◇Through curing time varies with the coating thickness, environmental temperature and humidity. Generally, it takes about 24 hours or more for RTV to cure completely at the room temperature.
◇Other available types include reduced LMW(Low Molecular Weight) siloxane types, thermally conductive types and flame resistance types.
【One-component Condensation Cure Type】
This kind of LTV rubber、which has properties low viscosity、high density and good thermal conductivity、is an ideal material for filling and sealing heat-dissipating dynamicl devices. With low viscosity property, it is convenient to apply to electronic devices with high-density components and endures good thermal conductivity and heat resistance owing to guarantee of complete filling.
【Two- component Condensation Cure Type】
This kind of RTV rubber、which has properties low viscosity、high density and good thermal conductivity、is an ideal material for filling and sealing heat-dissipating electronic modules. With low viscosity property, it is convenient to apply to electronic devices with high-density components and keeps good heat-dissipation in the meantime. Addition cure type RTV, which is especially designed to provide electronic devices made by materials of different thermal expansion rates with prompt airtightness and adhesion, can achieve strong adhesion and high curing degree in 20 minutes, Furthermore, it still shows excellent electric insulation, physical and chemical characteristics even when used at temperatures ranging from -50℃ to +200℃, thus perfectly suitable for applying to electronic modules working at high temperature and high humidity. Its superior adhesion, heat dispersion, electric insulation, flame resistance, non-contraction itself but super expansion and stretch absorption together with medium resistance and airtightness , greatly ensure electronic modules’stable working and an extended pot life.

Curing Method	Product	Tack-free Time (min)	Density （ g/cm3 ）	Hardness Durometer A	Tensile Strength (mpa)	Elongation at Break(%)
Acetic Acid Type	KQ11	≤60	1.0±0.1	≥20	≥0.8	≥180
	KQ12	≤30	1.1±0.1	≥25	≥1.0	≥160
	KQ13	≤30	1.3±0.1	≥30	≥1.2	≥150
	KQ15	≤30	1.4±0.1	≥40	≥1.5	≥120
	KQ17	≤30	1.5±0.1	≥50	≥2.0	≥100
Alcohol Type	KQ21	≤10	1.0±0.1	≥20	≥0.8	≥180
	KQ22	≤10	1.1±0.1	≥25	≥1.0	≥160
	KQ23	≤10	1.3±0.1	≥30	≥1.2	≥150
	KQ25	≤10	1.4±0.1	≥40	≥1.5	≥120
	KQ27	≤10	1.6±0.1	≥50	≥2.0	≥100
Oximel Type	KQ31	≤60	1.1±0.1	≥20	≥0.8	≥180
	KQ32	≤40	1.2±0.1	≥25	≥1.0	≥160
	KQ33	≤30	1.3±0.1	≥30	≥1.2	≥150
	KQ35	≤20	1.4±0.1	≥40	≥1.5	≥120
	KQ37	≤20	1.5±0.1	≥50	≥2.0	≥100

    

Shear Strength (Mpa)	Volume Resistivity (Ω.cm)	Dielectric Breakdown Strength((KV/mm)	Dielectric Constant (50Hz)	Dielectric Loss Factor (50Hz)	Thermal Conductivity (W/m.k)	Flammability (Ul94)
≥0.5	≥0.5×10 14	≥12	≤5.0	≤0.05	..	..
≥0.5	≥0.5×10 14	≥12	≤5.0	≤0.05	..	HB
≥0.7	≥0.5×10 14	≥15	≤5.0	≤0.05	..	V‐0
≥1.0	≥0.5×10 14	≥18	≤4.0	≤0.05	..	V‐0
≥1.0	≥0.5×10 14	≥20	≤4.0	≤0.05	..	V‐0
≥0.5	≥1×10 14	≥17	≤5.0	≤0.05	..	..
≥0.5	≥1×10 14	≥17	≤4.0	≤0.05	..	HB
≥0.7	≥1×10 14	≥20	≤4.0	≤0.05	0.3	V‐0
≥1.0	≥1×10 14	≥22	≤3.5	≤0.05	0.5	V‐0
≥1.0	≥1×10 14	≥24	≤3.5	≤0.05	0.8	V‐0
≥0.5	≥1×10 14	≥17	≤5.0	≤0.05	..	..
≥0.5	≥1×10 14	≥17	≤4.0	≤0.05	..	HB
≥0.7	≥1×10 14	≥20	≤4.0	≤0.05	0.2	V‐0
≥1.0	≥1×10 14	≥22	≤3.5	≤0.05	0.2	V‐0
≥1.0	≥1×10 14	≥24	≤3.5	≤0.05	0.4	V‐0